Flip chip interconnects with electroplated, extended eutectic solder.

by Glezen, John H.; Naseem, H. A.; Fritsch, Ingrid; Ulrich, Richard K.; Brown, William D.; Schaper, L. W.

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A study was performed to electroplate an extended eutectic solder structure. The use of electroplating technol. enabled firm control over the size and shape of grains in the deposit. Grain size and shape, in turn, affected the diffusion of lead and tin through bulk phases as well as along grain boundaries. The control over diffusion impacted the reflow properties of the final solder structure. The reflow properties affected the strength of the flip-chip bond, as well as the self-alignment properties of the solder. The structures were then tested for their elec. resistance. [on SciFinder(R)]

Conference
Proceedings - International Conference on Multichip Modules and High Density Packaging, Denver, Apr.15-17, 1998
Year
1998
Division
319
URL
http://ieeexplore.ieee.org/document/670801/
DOI
10.1109/ICMCM.1998.670801