Solid-State Qubits: 3D Integration and Packaging
Oliver III, William F
- Title
- Solid-State Qubits: 3D Integration and Packaging
- Authors
- Rosenberg, D ;Weber, SJ ;Conway, D ;Yost, DRW ; Mallek, J ; Calusine, G ; Das, R;Kim, D ;Schwartz, ME ;Woods, W; Yoder, JL;Oliver, WD
- Journal
- IEEE MICROWAVE MAGAZINE
- Volume
- 21
- Issue
- 8
- Year
- 2020
- DOI
- 10.1109/MMM.2020.2993478