Two-layer, planar, superconducting multichip module technology
Chan, Fui T.
- Title
- Two-layer, planar, superconducting multichip module technology
- Authors
- Luo, W.A.; Yao, H.J.; Zhang, G.; Chan, F.T.; Ang, S.S.; Brown, W.D.; Salamo, G.J.; Cooksey, J.W.
- Journal
- 2000 Hd International Conference on High-Density Interconnect and Systems Packaging
- Volume
- 4217
- Issue
- Year
- 2000
- Start Page
- 226
- URL
- ISBN/ISSN
- 0277-786X
- DOI